SEMICONDUCTOR SCRUBBER
BDC – Scrubber (BECO) is a device that purifies harmful gases discharged after being used in semiconductor and FPD (Flat Pannel Display) process equipment. It is a gas decomposition scrubber using plasma.
Process capability Semiconductor process toxic gas treatment using high-temperature plasma PFC gases (NF3, SF6, CF4, C2F6, etc.) Corrosive gases (CI2, F2, BCI3, HBr, etc.) Combustible gases (SiH4, TEOS, DCS, H2, etc.
Features Reducing maintenance costs by extending the life of consumable parts Excluding secondary heat sources (LPG, LNG, etc.) Utilization of Plasma Arc Reduction of maintenance and utility costs through recycling of PCW PM cycle reduction through efficient module operation Large-capacity gas treatment using 4 chambers High processing efficiency of PFC GAS
| MODEL | DBC-BECO |
| Gas Process | Plasma Arc |
| Total Capacity | 300slm for CVD |
| Dimension | 800(W) x 800(D) x 1850(H) |
| Power Consumption | 11 Kw for CF4 DRE 90% 8 Kw for NF3 DRE 95% |
| Torch lifetime | > 12 Months |
| Target Gases / DRE | CF4 1.0 slm > 90% at 150slm inlet flow for Dry etch NF3 3.0 slm > 95% at 300slm inlet flow for CVD |
| MTBF / MTTR | > 6 months / 1.5hr for full maintenance |
| CDA | Adjustable 3~10 SLM |
| PCW | Adjustable 10~15 SLM |
| N2 | Adjustable 20~100 SLM |
| Intel Numbers | NW50- 4 inlets (※ Optional : NW50- 2inlets) |
○ DRE for PFC gases
CF4 > 90%
SF6 > 90%
NF3 > 95%
All other PFC gases treated with DRE>90%
○ Toxics gas emissions
HF, HCl, BCl3, HBr, SiF4 …< TLV and IDLH
Sub-TLV emissions achieved with chemical dosing (option)
○ N2O abatement: DRE>90%
○ Treatment capacity (per plasma torch):
Up to 150slm for CF4-containing gas streams
Up to 300slm for NF3-containing gas streams
