Suitable Product
Ceramic lens and flat silicone plastic package
EMC SMD LED lens and flat silicone plastic package
Mini-LED fluorescent film plastic packaging
The company's main business scope:
1. Technology development, assembly and sales of semiconductor automation equipment; existing new development equipment: MINILED glue injection film press integrated machine, photoelectric automatic eutectic machine eutectic furnace, etc.
2. Provide new/second-hand KS series, KAIJO series, ASM series and other automatic wire welding machines, ASM860, 862 automatic crystal bonder, DAGE tensile testing machine, and independent research and development: automatic transfer machine, modified automatic capping machine, manual gold wire ball welding machine, aluminum wire welding machine, tooling fixture, etc.;
3. The models produced by the company are mainly suitable for automatic packaging of optical communication devices. Such as TO38, TO39, TO46, TO56, and COB and other related devices.
4. Technical service Provide repair, maintenance, modification and other services, and provide customers with professional supporting process improvement and solutions. At the same time, it provides professional technical support for ASM, KNS, Kaijo and other mainstream packaging equipment.Molding technologies are used to seal semiconductors by electrically insulating them from the outside using resin. These technologies are essential to ensure the reliability of semiconductors !
Using servo press, clamping force can reach 120 tons
Compatible with large lead frames of 90mmx300mm
Standardized mold structure, easy to replace
High-efficiency cake feeding components
Support flexible expansion of up to 4 sets of presses to achieve high UPH
Equipped with a vision system to identify the feeding direction
Optional vacuum function
■ Vacuum thermoforming technology
■ Full servo motor drive
■ Three-channel vacuum system
■ Use the most advanced separation membrane technology to reduce the waste of molding materials
■ Easy to release the mold. The machine is clean. The mold is not corroded. The service life is increased
■ Universal dispensing system
■ Static elimination equipment, improve yield rate. The machine can be spliced to improve capital efficiency. It is suitable for small batch and large batch production. It can splice 1 host + 5 modules (MAX). Automatic loading and unloading module (option)
Features
1. Optimal for various kinds of LED packages with variable quantity production
2. Tuoxin proprietary compression molding method
3. Optimal for high-volume production of LED packages
4. Modular concept to adapt to different production quantities (up to 4 presses)
5. Ensures even, stable lens shape and high-precision molded products
6. Mmanually loaded substrae and automatically applied silicone resin on the chase
7. Environmentally friendly equipment that generates no waste
The company's main business scope:
1. Technology development, assembly and sales of semiconductor automation equipment; existing new development equipment: MINILED glue injection film press integrated machine, photoelectric automatic eutectic machine eutectic furnace, etc.
2. Provide new/second-hand KS series, KAIJO series, ASM series and other automatic wire welding machines, ASM860, 862 automatic crystal bonder, DAGE tensile testing machine, and independent research and development: automatic transfer machine, modified automatic capping machine, manual gold wire ball welding machine, aluminum wire welding machine, tooling fixture, etc.;
3. The models produced by the company are mainly suitable for automatic packaging of optical communication devices. Such as TO38, TO39, TO46, TO56, and COB and other related devices.
4. Technical service Provide repair, maintenance, modification and other services, and provide customers with professional supporting process improvement and solutions. At the same time, it provides professional technical support for ASM, KNS, Kaijo and other mainstream packaging equipment.
LED semiconductor plastic packaging equipment is used to package LED chips into LED lamp beads, which are widely used in LED lighting, LED display, LED backlight and other fields. Specific applications include but are not limited to the following aspects:
LED lighting: LED semiconductor plastic packaging equipment is used to produce various types of LED lamp beads, such as LED bulb lamps, LED lamp tubes, LED downlights, LED spotlights, LED wall washers, etc., for indoor lighting, outdoor lighting, Landscape lighting and other fields.
LED display: LED semiconductor plastic packaging equipment is used to produce LED display modules, including various application scenarios such as indoors, outdoors, venues, and stages.
LED backlight: LED semiconductor plastic packaging equipment is used to produce LED backlights, including backlights for various electronic devices such as TVs, mobile phones, and tablet computers.
Automotive lighting: LED semiconductor plastic packaging equipment is used to produce LED lighting products such as automotive headlights, tail lights, turn signals, fog lights, etc., which improves the brightness and energy efficiency of automotive lighting.
Other fields: LED semiconductor plastic packaging equipment is also used to produce LED products in various fields such as LED signal lights, LED night lights, LED flashlights, LED street lights, and LED billboards.
With the continuous development of LED technology and the continuous expansion of application scenarios, the application of LED semiconductor plastic packaging equipment will continue to expand and deepen.
