Auto Contact Angle Analyzer
Model : Pioneer 300 series
Features
The Pioneer 300 Wafer Surface Analysis System is designed for 300mm semiconductor wafer processing quality control. The Pioneer 300 provides quick and accurate contact angle/ surface energy measurements of the wafer surface for evaluating adhesion, cleanliness and surface treatments. The position of the optic assembly is computer-controlled to allow for wafer surface mapping and can be precisely adjusted along the x-, y-, or z- axis.
The use of the rotation stage inside makes this system well suited for semiconductor wafer applications and the closed sample stage prevents the samples from being contaminated by any organic particles. That insures the system can be used to monitor the ultra clean surface processing of silicon wafers.
Rotation stage for 300 mm wafer
Wafer auto mapping display system
Fully automated image analysis & data calculation by computer.
Contact Angle & Surface Energy
Applications
Coating assessment of the HMDS process.
Evaluation of surface cleanliness processing
Surface treatment for wafers
Detection of organic contamination for wafers
Specification
|
Contact Angle |
0~180 °, ± 1 ° accuracy |
|
Max. Sample size |
300 mm Wafer (up to 12 inches wafer available) |
|
Zoom |
6.4 fold |
|
Focus |
Internal, ±6 (mm) |
|
Resolution |
768 x 576 NTSC, 16M color |
|
Moving type |
Auto mapping system (X-, Y-, Z- and Rotating) |
|
Dispenser type |
Automatic syringe system |
|
Evaluation method |
Contact angle & Surface energy |
|
Operating system |
Window XP |
