1.Chemical composition
C | Mn | Si | P | S | Cu | Cr | Mo | NI | Co | Fe |
≤ | ||||||||||
0.03 | 0.5 | 0.30 | 0.02 | 0.02 | 0.2 | 0.2 | 0.2 | 28.5~29.5 | 16.8~7..8 | Margin |
2.Properties
| Property | sintered | HIPed |
|---|---|---|
| Density g /cm3 | 8.0 | 8.35 |
| Hardness / HV1 | 160 | 150 |
| Youngs Modulus / GPa | 138 | 138 |
| reduction of area at fracture / % | 30 | 30 |
| yield strength / MPa | 270 | 270 |
| thermal conductivity / W/Km | 17 | |
| Curie Temperature / °C | 435 | |
| electrical resistivity Ω mm2 / m | 0.49 | |
| specific heat J/gK | 0.46 | |
thermal expansion coefficient/10−6 K−1 (25–200 °C) | 5.5 | |
| (25–300 °C) | 5.1 | |
| (25–400 °C) | 4.9 | |
| (25–450 °C) | 5.3 | |
| (25–500 °C) | 6.2 | |
3.Heat Treatment
Because of its effect on the actual structure of the material, there is a distinction made
between heat treating the material to facilitate fabrication and heat treating the material to
ensure optimum conditions for glass sealing, plating or brazing.
4.Stress Relief Annealing
To relieve stress and work hardening of parts at intermediate stages
of fabrication. It is intended particularly for drawing, forming and
spinning operations.
1. Wash and degrease parts.
2. Anneal in atmosphere controlled furnace. Atmosphere may be
wet or dry hydrogen, dissociated ammonia, cracked gas or similar
neutral atmosphere.
3. Annealing temperature is not critical; however, high temperatures
